50% OFF

In-Depth Research Report on the Memory Chip Industry: Price Hike Cycle and Domestic Substitution Opportunities

#存储芯片 #国产替代 #半导体 #涨价周期 #长鑫存储 #IPO #DRAM #NAND_Flash #AI芯片 #科创板
Positive
A-Share
January 19, 2026

Unlock More Features

Login to access AI-powered analysis, deep research reports and more advanced features

About us: Ginlix AI is the AI Investment Copilot powered by real data, bridging advanced AI with professional financial databases to provide verifiable, truth-based answers. Please use the chat box below to ask any financial question.

Related Stocks

603986
--
603986
--
688008
--
688008
--
600584
--
600584
--
002156
--
002156
--
002371
--
002371
--
688012
--
688012
--
002409
--
002409
--
688019
--
688019
--

Based on the latest market data and in-depth analysis, the following is a systematic research report on the skyrocketing memory chip prices and the impact of ChangXin Memory Technologies (CXMT)'s listing on the industrial chain:


In-Depth Research Report on the Memory Chip Industry: Price Hike Cycle and Domestic Substitution Opportunities
I. Skyrocketing Memory Chip Prices: The Arrival of a Super Bull Market Cycle
1.1 Price Hike Hits an All-Time High

The 2025 memory chip market has entered an unprecedented “super bull market” phase. According to data from TrendForce and the Korea Economic Daily,

the annual price hike of memory chips in 2025 is staggering
:

Product Type 2025 Price Hike Projected Price Hike in Q1 2026
DDR4 16Gb
1800%
60%-70%
DDR5 16Gb
500%
55%-60%
512Gb NAND Flash
300%
33%-38%

According to Counterpoint Research’s forecast, memory contract prices will continue to climb in Q1 2026, with an expected hike of

40%-50%
, and are expected to rise by another 20% in Q2 [1][2][3].

1.2 Analysis of Price Hike Drivers

(1) Explosive Demand for AI Computing Power

  • The total investment in AI infrastructure by the four major North American cloud service providers (CSPs) including Google, Meta, Microsoft, and Amazon AWS is expected to hit a record high of
    USD 600 billion
    in 2026 [1]
  • The consumption of DRAM and NAND flash in AI servers is expected to surge by
    40%-50%
    year-on-year in 2026
  • The surging demand for HBM (High Bandwidth Memory) has led to the transfer of traditional DRAM production capacity, exacerbating supply shortages for consumer-grade products

(2) Severe Supply-Demand Imbalance

  • Global memory chip supply is expected to grow by only
    7%-8%
    in 2026, far lower than the
    20%-25% demand growth rate
    [4]
  • The construction cycle for new wafer fabs and packaging capacity is 2-3 years, making it difficult to fundamentally ease the shortage in the short term
  • Samsung and SK Hynix have shifted a large amount of production capacity to higher-margin HBM products

(3) Cost Pressure Pass-Through to End Products

The proportion of memory chips in the cost of end products has risen from about
20%
to
over 30%
, and exceeds
35%
for some high-end models [5]:

  • Lenovo has raised prices of laptops priced above 5,000 yuan by 500-1,500 yuan, representing a 5%-10% hike
  • Dell and HP plan to raise prices, with a maximum hike of 20%
  • The average selling price of smartphones is expected to rise to
    USD 465
    in 2026

II. ChangXin Memory Technologies (CXMT) IPO: A Milestone for Domestic Substitution
2.1 Company Overview and IPO Progress

ChangXin Memory Technologies Co., Ltd. submitted its prospectus to the STAR Market on December 30, 2025, and

its IPO review status has been updated to “Accepted”
, making it a major player in China’s semiconductor hard technology landscape [6][7].

The shareholding structure is highly dispersed
with no controlling shareholder or actual controller. Major shareholders include:

  • Qinghui Jidian: 21.67%
  • National Integrated Circuit Industry Investment Fund Phase II: 8.73%
  • Alibaba Cloud Computing: 3.85% (invested 6.1 billion yuan in June 2025)
  • 60 shareholders including GigaDevice, Xiaomi, and Tencent
2.2 Financial Data: A Turnaround from Huge Losses to Profitability
Indicator 2024 2025 Change
Revenue 24.2 billion yuan 55-58 billion yuan
+127%
Net Profit -9.1 billion yuan 2-3.5 billion yuan
Turnaround from loss to profit
Gross Profit Margin - 4.63% in H1 2025, reached 35% in Q3
Significantly improved

The Q4 2025 single-quarter performance is particularly outstanding
: Revenue reached 22.9-25.9 billion yuan, net profit reached 8-9.5 billion yuan, with a net profit margin of
35%-40%
[6][7][8].

2.3 Technical Strength and Market Position
  • The world’s 4th largest DRAM enterprise
    , with a market share of approximately
    2.51%
  • The
    only
    IDM enterprise in mainland China to achieve mass production of DRAM
  • Adopted a “generation-skipping R&D” strategy to complete mass production on its 1st to 4th generation process technology platforms
  • Operates
    3 12-inch wafer fabs
    in Hefei and Beijing
  • Monthly production capacity doubled from
    100,000 wafers
    in Q1 2024 to
    200,000 wafers
    in Q1 2025 [6][9]
2.4 IPO Fundraising Plan
Item Amount Proportion
Planned Fundraising
29.5 billion yuan
100%
R&D 9 billion yuan 30.5%
Technological Transformation/Expansion Projects 25.5 billion yuan 69.5%
Equipment Procurement (Estimated)
Approximately 20 billion yuan
Approximately 68%

III. In-Depth Analysis of Impact on the Industrial Chain
3.1 Industrial Chain Overview
Upstream: EDA Tools + Manufacturing Equipment + Semiconductor Materials
          ↓
Midstream: Wafer Manufacturing (CXMT) - Core segment with the highest barriers
          ↓
Downstream: Packaging & Testing + Memory Modules
          ↓
End Market: Mobile Phones/PCs/Servers/Auto/AI Devices
3.2 Analysis of Benefits by Segment
(1) Upstream: Equipment and Material Suppliers — Benefit Level: ★★★★★

Core Equipment Suppliers
:

  • NAURA Technology
    : Etching and thin film deposition equipment, technology on par with overseas peers, deeply tied to CXMT’s expansion [10]
  • AMEC
    : 5nm etcher adopted in advanced production lines, technology has reached international standards [10]
  • Huahai Qingke
    : 12-inch CMP equipment with over 60% market share, core supplier for HBM production lines

Core Material Suppliers
:

  • Yake Technology
    : Global market share of 18% in HBM precursors, exclusive supplier to SK Hynix [11]
  • Anji Technology
    : Leader in CMP slurries, with over 20% domestic market share in memory slurries
  • Zhengfan Technology
    : Gas and material delivery systems, “no substantial difference” from foreign suppliers [10]
(2) Midstream: Wafer Manufacturing — Core Beneficiary

CXMT, as the “source” of the industrial chain, directly benefits from:

  • Gross profit margin improvement driven by memory chip price hikes (reached 35% in Q3)
  • Market share expansion amid the domestic substitution trend
  • Explosive demand for AI server memory
(3) Downstream: Packaging & Testing and Module Manufacturers — Benefit Level: ★★★★☆

Packaging & Testing Segment
:

  • JCET
    : The world’s 3rd largest packaging and testing enterprise, leading HBM packaging yield, certified by NVIDIA [11]
  • Tongfu Microelectronics
    : Covers multiple categories of memory packaging and testing, closely cooperates with major memory manufacturers
  • Shenzhen Kaifa Technology
    : China’s largest DRAM packaging and testing enterprise, high yield in HBM3 packaging

Module Segment
:

  • Longsys
    : Leader in memory modules, Lexar brand memory cards rank 2nd globally, PCIe SSDs for AI servers rank top 10 globally, rose over 15% on January 16, 2026 to hit a record high [12][13]
  • BIWIN
    : Integrated packaging and testing, global market share leader in AI glasses memory, net profit expected to surge 427%-520% year-on-year in 2025, hit a 20% daily limit on January 16 [12][13]
(4) End Market: Coexistence of Cost Pressure and Domesticization Opportunities
  • Mobile Phone/PC Manufacturers
    : Facing cost pressure, forced to raise prices
  • Automobile Manufacturers
    : Supply chain awareness awakened, accelerating test and adoption of domestic chips
  • Cloud Service Providers
    : Alibaba Cloud, Tencent, ByteDance, etc., have become core customers of CXMT

IV. Market Structure and Competitive Landscape
4.1 Global DRAM Market Structure
Manufacturer Market Share Nature
Samsung Electronics 41.54% Overseas Leader
SK Hynix 34.44% Overseas Leader
Micron Technology 21.51% Overseas Leader
ChangXin Memory Technologies (CXMT)
2.51%
Domestic Substitution Player

The three overseas giants together account for

97.5%
of the market share, forming a stable CR3 structure [1][6].

4.2 Industry Development Trends

Positive Factors
:

  • Sustained high growth in demand for AI computing power
  • Strong policy support for domestic substitution
  • Memory chip prices entering a super bull market cycle
  • Accelerated technological iteration of CXMT (the technology gap in DDR5 has been shortened to 3-4 years)

Risk Factors
:

  • Ban on high-end EUV lithography machines, bottlenecks in technological catch-up
  • Synchronized expansion of overseas giants, risk of price cycle fluctuations
  • The domestic ecosystem still lags behind in high-end materials and equipment
  • Intensified market competition, risk of price wars [10]

V. Investment Recommendations and Concept Stock Sorting
5.1 Core Beneficiary Targets in the Industrial Chain
Industrial Chain Segment Company Name Core Logic Benefit Level
Chip Design
GigaDevice Top 3 in global NOR Flash, synergistic with niche DRAM ★★★★★
Chip Design
Montage Technology 40% global share of DDR5 interface chips, JEDEC standard setter ★★★★★
Packaging & Testing
JCET Leading HBM packaging yield, certified by NVIDIA ★★★★★
Packaging & Testing
Tongfu Microelectronics Core beneficiary of memory packaging and testing ★★★★☆
Equipment
NAURA Technology Etching equipment deeply tied to CXMT ★★★★★
Equipment
AMEC 5nm etcher adopted in advanced production lines ★★★★☆
Materials
Yake Technology 18% global share of HBM precursors ★★★★★
Materials
Anji Technology Leader in CMP slurries ★★★★☆
Modules
Longsys Leader in memory modules, top 10 globally in AI server SSDs ★★★★★
Modules
BIWIN Global leader in AI glasses memory, surging performance ★★★★★
5.2 Market Performance Verification

On January 16, 2026, the memory chip concept sector performed strongly [12][13]:

  • BIWIN:
    20% daily limit
  • Longsys:
    Rose over 15% to hit a record high
  • Hunan HSJ Electronics, Puran Microelectronics, Ingenic Semiconductor, etc., followed the upward trend
  • The sector saw a net inflow of
    8.839 billion yuan
    from main funds

VI. Conclusions and Outlook
6.1 Core Conclusions
  1. Memory chips enter a super bull market
    : 2025 price hike hit a record high, expected to rise another 60%-70% in Q1 2026, and supply-demand imbalance is expected to persist until 2027
  2. CXMT IPO is a milestone
    : Marks the transformation of China’s semiconductor industry from “single-point breakthrough” to “full-chain resonance”, a key step in the industrialization of domestic memory chips
  3. The entire industrial chain benefits
    : All segments including equipment, materials, packaging and testing, and modules will continue to benefit from CXMT’s expansion and the domestic substitution trend
  4. Clear investment window
    : The super cycle of memory chips overlaps with the historic opportunity of domestic substitution, and the memory chip industrial chain is expected to see simultaneous growth in volume and price in 2026
6.2 Risk Warnings
  • Risk of cyclical fluctuations in the memory chip industry
  • Risk of competition and price wars from overseas giants
  • Risk that the localization process of high-end equipment/materials falls short of expectations
  • Risk of international geopolitical conflicts

References

[1] Securities Times Network - “Maximum Price Hike of 70%! Two Major Chip Giants, Major Breaking News!” (https://www.stcn.com/article/detail/3572106.html)

[2] AJ Securities - In-Depth Industry Report “Memory Chip Price Hikes to Continue Until 2026” (https://pdf.dfcfw.com/pdf/H3_AP202512221805753876_1.pdf)

[3] Counterpoint Research - Report on the “Super Bull Market” Phase of the Memory Market

[4] Sina Tech - “A Set of Memory Sticks Worth an Apartment in Shanghai: Will 2026 Be the ‘Most Expensive Year’ for Consumer Electronics?” (https://tech.sina.cn/2026-01-18/detail-inhhsscc2347977.d.html)

[5] TrendForce Consulting - Analysis of Memory Chip Cost Proportion

[6] Eastmoney.com - “CITIC Securities: CXMT IPO Application Accepted, Optimistic About Investment Opportunities in Domestic Memory Chain” (https://finance.eastmoney.com/a/202512313606365784.html)

[7] Jiemian News - “From 37 Billion Yuan Loss to Profit Turnaround: Insights from CXMT’s IPO” (https://www.jiemian.com/article/13874829.html)

[8] Sina Finance - “From 37 Billion Yuan Loss to Profit Turnaround: Insights from CXMT’s IPO” (https://finance.sina.com.cn/jjxw/2026-01-14/doc-inhhfrsx8465630.shtml)

[9] Sina Tech - “More Than Chips: In-Depth Analysis of How CXMT Drives the ‘Takeoff’ of the Entire Memory Industrial Chain” (https://finance.sina.com.cn/tech/roll/2026-01-13/doc-inhhcxix4900166.shtml)

[10] Jiemian News - Interviews with CXMT’s Supply Chain Enterprises

[11] Eastmoney.com - “2026 High Growth Logic Confirmed, Attached with Core Concept Stocks of the Entire Memory Chip Industrial Chain” (https://caifuhao.eastmoney.com/news/20260117054444893173810)

[12] CLS.cn - “Memory Chip Concept Sector Continues to Strengthen in Afternoon Trading, BIWIN Hits 20% Daily Limit” (https://www.cls.cn/subject/2409)

[13] Securities Times Network - “Resonance of Price Hikes in Memory, Metals, and Batteries: Automakers Launch a ‘Defensive War’ Against Supply Chain Costs” (https://www.stcn.com/article/detail/3591871.html)

[14] WSTS (World Semiconductor Trade Statistics) - Global DRAM Market Size Forecast

[15] TrendForce - Memory Chip Price Trend Data

Previous
No previous article
Next
No next article
Related Reading Recommendations
No recommended articles
Ask based on this news for deep analysis...
Alpha Deep Research
Auto Accept Plan

Insights are generated using AI models and historical data for informational purposes only. They do not constitute investment advice or recommendations. Past performance is not indicative of future results.