In-Depth Analysis of MediaTek Dimensity 9500s' Competitiveness in the High-End Market

Based on the latest information I have collected, I will now conduct a systematic and comprehensive analysis for you.

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MediaTek Dimensity 9500s was officially released on January 15, 2025, as a 3nm process mobile chip targeting the flagship popularization market. According to official technical documents [1][2], its core architecture configuration is as follows:

Technical Dimension	Dimensity 9500s Specifications	Technical Significance
Process Technology	TSMC 3nm N3P	Advanced process on par with Qualcomm’s latest flagship chip
CPU Architecture	All-big-core design: 1×Cortex-X925 (3.73GHz) + 3×Cortex-X4 + 4×Cortex-A720	Completely abandons the traditional “big core + small core” hybrid architecture
GPU	Immortalis-G925	Supports ray tracing technology, equipped with OMM Ray Tracing Engine
AI Engine	NPU 880	Supports mainstream large language models and Stable Diffusion image generation
5G Performance	Release-17 modem, 7Gbps downlink	4-carrier aggregation technology
Gaming Support	165Hz ultra-high frame rate	MAGT 3.0 Dynamic Regulation + MFRC 3.0 Frame Multiplication Technology

The Dimensity 8500 was released simultaneously, adopting a 4nm process and equipped with a Mali-G720 GPU, with a 25% increase in peak performance and a 20% reduction in power consumption[2], forming a dual-product matrix strategy of “flagship popularization + light flagship”.

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From the process node perspective, both Dimensity 9500s and Qualcomm Snapdragon 8 Elite Gen 4/5 adopt TSMC’s 3nm N3P process[3][4], which means that at the basic process level, MediaTek has eliminated the technological generation gap with Qualcomm.

:

• CPU Architecture
  : Self-developed Oryon architecture, 2 Prime cores (4.6GHz) + 6 performance cores (3.62GHz)
• GPU
  : Adreno 840, 1.20GHz clock speed, first introduction of 16MB independent L2 cache
• 5G Modem
  : X85 5G, 12.5Gbps peak download rate
• AI Computing Power
  : Hexagon NPU, 100 TOPS comprehensive AI computing power

According to benchmark test data from NanoReview[5], the Dimensity 9500 scored approximately

in the AnTuTu 10 test, leading the Snapdragon 8 Elite (Gen 4)'s by about 23%. Detailed sub-item results are as follows:

Test Item	Dimensity 9500	Snapdragon 8 Elite Gen 4	Difference
AnTuTu Total Score	3,340,196	2,723,036	+23%
CPU Single-Core	975,847	624,873	+56%
Geekbench 6 Single-Core	3,518	3,155	+12%
Geekbench 6 Multi-Core	10,459	9,723	+8%

: The CPU architecture of the Dimensity 9500s (based on ARM’s public version) has an advantage in multi-core performance, which is mainly due to its “1+3+4” 8-core all-big-core design. In contrast, the Snapdragon 8 Elite Gen 5 has a higher single-core clock speed (4.6GHz vs 3.73GHz) thanks to its self-developed Oryon architecture.

The market positioning of the Dimensity 9500s is not directly targeting the top flagship position of the Snapdragon 8 Elite Gen 5, but rather adopting a

strategy[1]:

• Bring top-tier 3nm process and all-big-core architecture to a wider price range
• Enhance gaming experience through the Immortalis-G925 GPU and ray tracing technology
• Strengthen edge-side AI capabilities (supports multimodal model inference)

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For MediaTek, the 3nm process of the Dimensity 9500s is of milestone significance:

Time Node	Process Technology	Market Significance
2020 and earlier	7nm/6nm	Dominant in the mid-to-low-end market
2021-2022	6nm/4nm	Test the high-end market, Dimensity 9000 series
2023-2024	4nm	Dimensity 9300 series gains a foothold
2025	3nm N3P	Compete on the same starting line as Qualcomm and Apple

1. Improved Energy Efficiency
   : Compared with 4nm process, 3nm N3P reduces power consumption by 5-10% under the same performance[4]
2. Transistor Density
   : Approximately 15-20% density increase, providing space for more computing units
3. Heat Control
   : More advanced process helps improve heat dissipation performance in high-performance scenarios

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According to Q3 2025 data from Counterpoint Research[6][7], the global smartphone AP-SoC market share pattern is as follows:

Manufacturer	Q3 2025 Market Share	YoY Change
MediaTek	34%	Maintains leadership
Qualcomm	24%	10 percentage points behind
Apple	18%	Relatively stable
UNISOC	14%	Steady growth
Samsung	6%	Slight recovery
HiSilicon (Huawei)	3%	Recovery trend

This means that

, and it has ranked first for consecutive quarters[7].

Although MediaTek leads in total volume, Qualcomm still maintains an advantage in the

. Counterpoint data shows[8] that Qualcomm delivered outstanding shipment performance in the high-end market in Q1 2025, with the Snapdragon 8 Elite being adopted by multiple flagship models[8].

The strategic significance of the Dimensity 9500 series lies in:

• Narrow the performance gap with Qualcomm in the high-end market
• Build brand image through flagship models such as the vivo X300 series and OPPO Find X9 series
• Attract price-sensitive high-end consumers through better cost performance

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Factor	Analysis
Process Parity	3nm N3P process eliminates the technological generation gap with Qualcomm
Performance Leadership	Dimensity 9500 series outperforms Snapdragon 8 Elite Gen 4 in benchmark tests such as AnTuTu
Cost Advantage	The licensing cost of ARM’s public architecture may be lower than Qualcomm’s self-developed Oryon architecture
Product Matrix	Full price range coverage strategy forms economies of scale
Brand Awareness	The reputation accumulated by the Dimensity 9000 series is being converted

Factor	Analysis
Brand Awareness	Qualcomm still occupies the “performance benchmark” position in consumers’ minds
High-End Model Binding	Samsung and Xiaomi’s top flagship models still primarily choose Qualcomm
Self-Developed Architecture Gap	Qualcomm’s Oryon CPU has advantages in single-core performance and energy efficiency
5G Modem Performance	Qualcomm’s X85 (12.5Gbps) significantly leads Dimensity’s 7Gbps
AI Ecosystem	Qualcomm’s Hexagon NPU has stronger TOPS computing power and a more mature software ecosystem

: The 3nm process of the Dimensity 9500s provides MediaTek with a , but it will still take time to substantially shake Qualcomm’s leading advantage:

• Short-term (2025-2026)
  : The Dimensity 9500s will help MediaTek gain more market share in the
  ¥3,500-¥5,000 price segment
  , but it will be difficult to replace Qualcomm’s dominant position in top-tier flagships (priced above ¥6,000)
• Mid-term (2027)
  : With the successful tape-out of MediaTek’s 2nm chip[9] and continuous technological iteration, it is expected to further narrow the gap
• Long-term
  : The key to determining victory lies in the competition of comprehensive strengths such as
  AI capabilities, connectivity performance, and software ecosystem

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MediaTek Dimensity 9500s adopts a 3nm process, which indeed provides

for its challenge to Qualcomm in the high-end mobile chip market. This chip has achieved the following strategic goals:

1. Technological Equity
   : Standing on the same starting line as Qualcomm’s flagship chips
2. Performance Transcendence
   : Some indicators lead competitors in benchmark tests
3. Price Downward Migration
   : Make flagship experiences accessible to more consumers
4. Brand Upgrade
   : Consolidate the high-end image of the Dimensity series

However, to truly shake Qualcomm’s foundation in the high-end market, MediaTek still needs to continue investing in

. The Dimensity 9500s is an important step in MediaTek’s high-end strategy, but changes in the market pattern will be a gradual process.

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[1] Zhenyes News Network - “Dual Chips Reshape the Flagship Niche Market Pattern! MediaTek Releases Dimensity 9500s and Dimensity 8500” (https://www.zhenyes.com/industry/6605.html)

[2] MediaTek Official Press Room - “MediaTek Unveils Dimensity 9500s and Dimensity 8500 to Propel Performance, Gaming and Efficiency in Flagship and Premium Smartphones” (https://www.mediatek.com/zh-tw/press-room/mediatek-unveils-dimensity-9500s-and-dimensity-8500-to-propel-performance-gaming-and-efficiency-in-flagship-and-premium-smartphones)

[3] IT Home - “2025 Flagship Smartphone Chip Showdown: Qualcomm 5th Generation Snapdragon 8 Elite vs MediaTek Dimensity 9500” (https://www.ithome.com/0/885/557.htm)

[4] IT Home - “2025 Snapdragon Summit · China Schedule Announced! Analysis of Key Highlights of the Next-Gen Qualcomm Snapdragon 8 Elite Platform” (https://www.ithome.com/0/881/284.htm)

[5] NanoReview - “Snapdragon 8 Elite (Gen 4) vs Dimensity 9500: tests and benchmarks” (https://nanoreview.net/en/soc-compare/qualcomm-snapdragon-8-gen-4-vs-mediatek-dimensity-9500)

[6] PConline - “Significantly Leading Competitors! MediaTek Regains the Top Spot in Global Smartphone AP-SoC Market Share in Q3 2025” (https://mobile.pconline.com.cn/2044/20446915.html)

[7] IT Home - “MediaTek Tops Q3 Global Mobile Chip Market with 34% Share Again, Secrets Behind Its Sustained Leadership” (https://www.ithome.com/0/908/414.htm)

[8] Sina Finance - “Q1 Global Smartphone Chip Market: MediaTek’s Strong Rebound” (https://finance.sina.com.cn/tech/roll/2025-07-07/doc-inferrrp6257096.shtml)

[9] MediaTek Official Press Room - “MediaTek Develops Chips Using TSMC’s 2nm Process” (https://www.mediatek.com/zh-cn/press-room)