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Analysis of Technical Route Differences Between Kunlunxin and Cambricon

#ai_chip #kunlun_xin #cambricon #asic #technical_analysis #dsa_architecture #chip_industry #baidu_kunlun
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January 5, 2026

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Analysis of Technical Route Differences Between Kunlunxin and Cambricon

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Analysis of Technical Route Differences Between Kunlunxin and Cambricon

Based on the searched data, both Kunlunxin and Cambricon occupy important positions in China’s AI chip sector, but they have significant differences in their technical routes:

1.
Technical Architecture Differences
Dimension Kunlunxin Cambricon
Architecture Type
Self-developed XPU-R architecture ASIC dedicated architecture + DSA computing architecture
Instruction Set
Not fully self-developed instruction set Fully self-developed Cambricon ISA instruction set
Technical Route
DSA architecture similar to Google TPU Hybrid technical path similar to ARM and Google TPU [1]
2.
Product Positioning and Application Scenarios

Kunlunxin (formerly Baidu Kunlun):

  • Origin: Internal AI accelerator project of Baidu, later developed independently
  • Core advantage: Deeply optimized for Baidu’s internal scenarios such as search, recommendation, voice, and image [3]
  • Application scenarios: Wide range of application cases in the Internet industry; the new product R200 is based on the new generation Kunlunxin self-developed architecture XPU-R [3]
  • Software ecosystem: Deeply integrated with Baidu PaddlePaddle, and supports other mainstream frameworks [3]

Cambricon:

  • Positioning: Focus on the AI dedicated chip track, covering cloud, edge, and end [1]
  • Product line:
    • Cloud: Si yuan 290, Si yuan 370 (up to 256 TOPS INT8 computing power)
    • Edge: MLU220 series
    • End: Intelligent processor IP [2]
  • Technical features: Adopts self-developed DSA computing architecture, forming different technical routes from Tesla DOJO’s memory-computing integrated architecture and Birentech’s near-memory architecture [2]
3.
Performance and Energy Efficiency Characteristics

Kunlunxin:

  • High computing power density
  • Supports mixed-precision computing and sparse computing acceleration [3]
  • Significant improvement in versatility and performance (new product R200) [3]

Cambricon:

  • Advantage: In specific application scenarios, computing power can be higher than that of GPU [2]
  • Disadvantage: Versatility is relatively poor [2]
  • The gap with NVIDIA is mainly reflected in versatility, but it has advantages in specific application scenarios [2]
4.
Market Positioning Differences
  • Kunlunxin
    : Relying on the Baidu ecosystem, it is more inclined to applications in the Internet industry and deeply integrated with the PaddlePaddle platform [3]
  • Cambricon
    : Oriented towards a wider layout of intelligent computing centers, with important projects nationwide, including Nanjing Intelligent Computing Center [2]
5.
Summary

Both belong to the

dedicated ASIC route
of domestic AI chips [3], but there are differences in technical implementation details:

  • Cambricon is more “specialized”, with a fully self-developed instruction set and excellent performance in specific scenarios
  • Kunlunxin, while ensuring dedicated acceleration capabilities, pays more attention to versatility and compatibility with mainstream ecosystems

From the perspective of industry trends, GPUs with strong versatility have more advantages during the rapid development period of large models, but when certain paradigms of large models are fixed, optimized dedicated chips may perform better [1]. This is also the basis for the long-term coexistence of the two technical routes.


References:

[1] 36Kr - “寒武纪已成老登” (https://m.36kr.com/p/3600720464412681)
[2] 东方财富网 - “AI大模型与异构算力融合技术白皮书” (https://pdf.dfcfw.com/pdf/H3_AP202510141762072518_1.pdf)
[3] 电子发烧友 - “主流国产AI算力芯片全景图” (https://www.eet-china.com/mp/a440458.html)

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Insights are generated using AI models and historical data for informational purposes only. They do not constitute investment advice or recommendations. Past performance is not indicative of future results.