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Breakthroughs of KunLun Core M300 Chip's Super Node Design in Large Model Training

#ai_chip #large_model_training #super_node_architecture #domestic_chip #chip_design #technology_breakthrough #kunlun_core
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January 3, 2026

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Breakthroughs of KunLun Core M300 Chip’s Super Node Design in Large Model Training

Based on currently available information, the super node design of the KunLun Core M300 chip has achieved multiple important breakthroughs in the field of large model training:

Key Breakthrough Points

1. Super Node Architecture Innovation

  • The M300 chip adopts an advanced super node design architecture, achieving efficient collaborative computing between chips by integrating multiple AI accelerator cards into a unified super node
  • Supports flexible expansion from 32 to 256 super nodes (2025-2026 development path), providing scalable infrastructure support for large-scale model training [1]

2. Significant Performance Improvements

  • Optimized under the DeepSeek V3/R1 PD-separated inference architecture, the M300 super node design has achieved
    a 95% improvement in single-card performance
  • Single-instance inference performance has been greatly improved by up to 8 times
    , which is of great significance for the inference deployment of large-scale language models [2]

3. Enhanced Large Model Training Capability

  • Supports efficient training of large models with hundreds of billions of parameters
  • Special optimization for the Transformer architecture has been made to improve the computational efficiency and stability of model training
Technical Advantages
Indicator Improvement Significance
Single-card performance +95% Higher computing density, reducing unit computing cost
Inference performance +8x Supports real-time inference deployment of larger-scale models
Super node expansion 32→256 Supports full-process computing needs from R&D to production
Industrial Impact
  1. Lowering the threshold for large model training
    : Providing a more cost-effective domestic AI computing solution through the super node architecture
  2. Improving training efficiency
    : Optimized inter-chip communication and computing collaboration mechanisms shorten the model iteration cycle
  3. Enhancing independent controllability
    : Reducing dependence on overseas high-end AI chips and ensuring computing power security

The super node design of the KunLun Core M300 represents an important technological breakthrough in China’s AI chip field, providing solid infrastructure support for the development of domestic large models.


References:

[1] Zhihu - “Behind Baidu’s Response to ‘KunLun Core Listing’: Traditional Business Under Pressure, Needing a New Story” (https://zhuanlan.zhihu.com/p/1981299020845572411)
[2] iyiou Data - “KunLun Core (Beijing) Technology Co., Ltd.” (https://data.iyiou.com/company/details/e72be2a18228cf57002f6df6ae59849d/profile)

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